Affect of anneal temperature on all-copper flip-chip connections formed via electroless copper deposition

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 1, 2012, Pages 79-84

  Koo, Hyo Chol ^a   Lightsey, Charles ^a   Kohl, Paul A ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

Bonding; flip chip; solder

Indexed keywords

ANNEAL TEMPERATURES; COPPER SURFACE; ELECTROLESS; ELECTROLESS BATH; ELECTROLESS COPPER; ELECTROLESS COPPER DEPOSITION; FABRICATION TECHNIQUE; FLIP CHIP INTERCONNECTS; FLIP-CHIP; FLIP-CHIP CONNECTIONS; MECHANICAL CONNECTIONS;

BONDING; ELECTROLESS PLATING; HYDROGEN; SOLDERING ALLOYS;

COPPER;

EID: 84859070398     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2011.2176492     Document Type: Article

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