Aqueous-Develop, Photosensitive Polynorbornene Dielectric: Properties and Characterization

Journal of Electronic Materials

Volumn 38, Issue 6, 2009, Pages 778-786

  Rajarathinam, Venmathy ^a   Lightsey, C Hunter ^a   Osborn, Tyler ^a   Knapp, Brian ^b   Elce, Edmund ^b   Bidstrup Allen, Sue Ann ^a   Kohl, Paul A ^a  

^a Georgia Institute of Technology   (United States)

^b Promerus LLC   (United States)

Author keywords

Crosslinking; Dielectric properties; Nanoindentation; Polynorbornenes

Indexed keywords

ABSORPTION COEFFICIENTS; CROSS-LINKED FILMS; CROSSLINKING REACTION; DIELECTRIC MEASUREMENTS; HIGH ASPECT RATIO; HIGH FIDELITY; NEGATIVE TONES; POLYNORBORNENE; POLYNORBORNENES; PROCESSING CONDITION; SIDE WALLS;

ASPECT RATIO; CERAMIC CAPACITORS; DIELECTRIC PROPERTIES; INFRARED SPECTROSCOPY; LIGHT SENSITIVE MATERIALS; MICROELECTRONICS; NANOINDENTATION; PHOTOSENSITIVITY; SPECTROSCOPIC ANALYSIS; THICK FILMS;

POLYMER FILMS;

EID: 67650447974     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-009-0741-3     Document Type: Conference Paper

References (31)

1. P. Chiniwalla Y. Bai E. Elce R. Shick W.C. McDougall S.A. Bidstrup Allen P.A. Kohl 2003 J. Appl. Polym. Sci. 89 568 10.1002/app.12234
2. P. Chiniwalla Y. Bai E. Elce R. Shick S.A. Bidstrup Allen P.A. Kohl 2004 J. Appl. Polym. Sci. 91 1020 10.1002/app.13045
3. Y. Bai P. Chiniwalla E. Elce S.A. Bidstrup Allen P.A. Kohl 2004 J. Appl. Polym. Sci. 91 3031 10.1002/app.13530
4. Y. Bai P. Chiniwalla E. Elce R. Shick J. Sperk S.A. Bidstrup Allen P.A. Kohl 2004 J. Appl. Polym. Sci. 91 3023
5. R. Feng R.J. Farris 2003 J. Micromech. Microeng. 13 80
6. J.M. Shaw J.D. Gelome N. Labianca W.E. Conley S.J. Holmes 1997 IBM J. Res. Dev. 41 81
7. J.D. Gelorme, R.J. Cox, and S.A.R. Gutierrez, International Business Machines Corporation (IBM), U.S. patent no. 4,882,245 (1989).
8. K.Y. Lee N. LaBianca S.A. Rishton 1995 J. Vac. Sci. Technol. B 13 3012
9. N. Labianca 1993 Elecrochem. Soc. Proc. 95-18 386
10. A. Bertsch, H. Lorenz, and P. Renand, IEEE Micro. Electro. Mech. Syst. (1998), p. 18.
11. M. Despont, H. Lorenz, N. Fahrni, J. Brugger, P. Renaud, and P. Vettiger, 10th IEEE Micro. Electro. Mech. Syst. (1997), p. 518.
12. H. Lorenz M. Laudon P. Renaud 1988 Microelectron. Eng. 41-42 371
13. H. Lorenz M. Despont N. Fahrni N. Labianca P. Renaud P. Vettiger 1997 Macromech. Microeng. 7 121
14. MicroChem Website, http://www.microchem.com/products/pdf/SU- 82000DataSheet2000-5thru2015Ver4.pdf (2008).
15. W.C. Oliver G.M. Pharr 1992 J. Mater. Res. 7 1564
16. American Society for Testing and Materials, Standard Test Methods for AC Loss Characteristics and Permittivity (Dielectric Constant) of Solid Electrical Insulating Materials (Philadelphia, PA, 1992).
17. C.A. Klein 2000 J. Appl. Phys. 88 5487
18. J.L. Loubet J.M. Georges O. Marchesini G. Meille 1984 J. Tribol.-T. ASME 106 43
19. S. Jiang X. Li S. Guo Y. Hu J. Yang Q. Jiang 2005 Smart Mater. Struc. 14 769
20. G.A. Shaw J.S. Trethewey A.D. Johnson W.J. Drugan W.C. Crone 2005 Adv. Mater. 17 1123
21. Z.Y. Yuan D. Zu Z.C. Ye B.C. Cai 2005 J. Mater. Sci. Technol. 21 319
22. M.R. VanLandingham J.S. Villarrubia W.F. Guthrie G.F. Meyers 2001 Macromol. Symp. 167 15
23. B.J. Briscoe L. Fiori E. Pelillo 1998 J. Phys. D Appl. Phys. 31 2395
24. L. Shen I.Y. Phang T.X. Liu K.Y. Zeng 2004 Polymer 45 8221
25. E. Wornyo K. Gall F. Yang W. King 2007 Polymer 48 3213
26. C. Klapperich K. Komvopoulos L. Pruitt 2001 J. Tribol-T. ASME 123 624
27. Micro Chemwebsite, http://www.microchem.com/products/su-eight-faq.htm (2009).
28. B. Eyre, J. Blosiu, and D. Wiberg, 11th IEEE Micro. Elec. Mech. Syst., Chicago, USA (1995), p. 218.
29. T.C. Osborn, H. Lighsety, and P.A. Kohl, Microelectron. Eng. (2009). doi: 10.1016/j.mee.2008.11.080.
30. K. Patel P.A. Kohl S.A. Bidstrup Allen 2001 J. Appl. Polym. Sci. 80 2328
31. J. Hammacher A. Fuelle J. Flaemig J. Saupe B. Loechel J. Grimm 2008 Microsyst. Technol. 14 1515