Mixed mode fracture toughness of lead-tin and tin-silver solder joints with nickel-plated substrate

Materials Science and Engineering: A

Volumn 404, Issue 1-2, 2005, Pages 244-250

  Siow, Kim S ^a,b   Manoharan, M ^a,c  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b UNIVERSITY OF SOUTH AUSTRALIA   (Australia)

^c GE GLOBAL RESEARCH   (United States)

Author keywords

Fracture toughness; Mixed mode; Sn 3.5Ag; Sn 37Pb; Solder joint

Indexed keywords

BRITTLENESS; COATINGS; ELECTROLESS PLATING; FRACTOGRAPHY; FRACTURE TOUGHNESS; MICROSTRUCTURE; NICKEL; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; SUBSTRATES; THERMAL EFFECTS; TIN ALLOYS;

ELECTROLESS NICKEL PLATING; MIXED MODE FRACTURE TOUGHNESS;

SOLDERED JOINTS;

FRACTURE TOUGHNESS;

EID: 23844517666     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2005.05.086     Document Type: Article

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