Microstructure, creep properties, and failure mechanism of SnAgCu solder joints

Journal of Electronic Materials

Volumn 35, Issue 7, 2006, Pages 1600-1606

  Sundelin, Janne J ^a   Nurmi, Sami T ^a   Lepistö, Toivo K ^a   Ristolainen, Eero O ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

Creep; Lead free solder; SnAgCu

Indexed keywords

COMPOSITION; CREEP; FRACTURE; INTERFACES (MATERIALS); INTERMETALLICS; MICROSTRUCTURE;

FAILURE MECHANISMS; LEAD-FREE SOLDERS; ORGANIC SOLDERABILITY PRESERVATIVE (OSP); SNAGCU;

SOLDERING ALLOYS;

EID: 33746864448     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0154-5     Document Type: Article

References (17)

1. C.A. Harper, Electronic Materials and Processes Handbook, 3rd ed. (New York: McGraw-Hill, 2003), p. 588.
2. Y. Fukuda, M.G. Pecht, K. Fukuda, and S. Fukuda, IEEE Trans. Compon. Packag. A 26, 616 (2003).
3. J.S. Hwang, Environment-Friendly Electronics: Lead-Free Technology (Bristol: Electrochemical Publications, 2001), p. 366.
4. J. Yu, D.K. Joo, and S.W. Shin, Acta Mater. 50, 4315 (2002).
5. F. Guo, J. Lee, and K.N. Subramanian, Solder Surf. Mount Technol. 15, 39 (2003).
6. H.G. Song, J.W. Morris, and F. Hua, Mater. Trans. 43, 1847 (2002).
7. J. McDougall, S. Choi, T.R. Bieler, K.N. Subramanian, and J.P. Lucas, Mater. Sci. Eng., A 285, 25 (2000).
8. J.J. Sundelin, S.T. Nurmi, T.K. Lepistö, and E.O. Ristolainen, Solder Surf. Mount Technol. 17, 3 (2005).
9. T. Hiramori, M. Ito, Y. Tanii, A. Hirose, and K.F. Kobayashi, Mater. Trans. 44, 2375 (2003).
10. P.-L. Wu, M.-K. Huang, C. Lee, and S.-R. Tzan, Mater. Chem. Phys. 87, 285 (2004).
11. K.Y. Lee, M. Li, D.R. Olsen, W.T. Chen, B.T.C. Tan, and S. Mhaisalkar, 2001 IEEE ECTC 51, 478 (2001).
12. J.-W. Yoon, S.-W. Kim, and S.-B. Jung, J. Alloys Compd. 391, 82 (2005).
13. M. Amagai, M. Watanabe, M. Omiya, K. Kishimoto, and T. Shibuya, Microelectron. Reliab. 42, 951 (2002).
14. H.-T. Lee, M.-H. Chen, H.-M. Jao, and T.-L. Liao, Mater. Sci. Eng., A 358, 134 (2003).
15. C.-B. Lee, I.-Y. Lee, S.-B. Jung, and C.-C. Shur, Mater. Trans. 43, 751 (2002).
16. J.J. Sundelin, S.T. Nurmi, T.K. Lepistö and E.O. Ristolainen, Mater. Sci. Eng., A420, 55 (2006).
17. D. Hull, Fractography: Observing, Measuring and Interpreting Fracture Surface Topography (Cambridge, England: Cambridge University Press, 1999), p. 366.