R-curve behavior of Cu-Sn3.0Ag0.5Cu solder joints: Effect of mode ratio and microstructure

Materials Science and Engineering: A

Volumn 527, Issue 3, 2010, Pages 724-734

  Nadimpalli, Siva P V ^a   Spelt, Jan K ^a  

^a UNIVERSITY OF TORONTO   (Canada)

Author keywords

Fracture; Intermetallic compounds; Lead free solder; Microstructure; Mode ratio; R curve

Indexed keywords

CANTILEVER BEAMS; COPPER ALLOYS; CRACKS; ENERGY RELEASE RATE; INTERMETALLICS; LEAD-FREE SOLDERS; MICROELECTRONICS; SILVER ALLOYS; SOLDERED JOINTS; STRAIN ENERGY; STRAIN RATE; TERNARY ALLOYS; TIN ALLOYS;

DOUBLE-CANTILEVER BEAM; INTERMETALLICS COMPOUNDS; JOINT EFFECT; MIXED-MODE LOADING; MODE RATIO; R-CURVE BEHAVIOR; R-CURVES; SOLDER JOINTS; STRAIN ENERGY RELEASE RATE; TIME-TEMPERATURE PROFILE;

MICROSTRUCTURE;

EID: 71849116710     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2009.08.046     Document Type: Article

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