Non-covalent dispersed carbon nanotube-benzocyclobutene composites as a bonding interface material for three-dimensional integration

Microelectronic Engineering

Volumn 91, Issue , 2012, Pages 33-38

  Xu, Xiangming ^a   Wang, Zheyao ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Benzocyclobutene (BCB); Bonding interface material (BIM); Carbon nanotube (CNT); Thermal conductivity; Three dimensional integration; Through silicon vias (TSVs)

Indexed keywords

3-D INTEGRATION; BENZOCYCLOBUTENE; BONDING ADHESIVE; BONDING INTERFACE MATERIAL (BIM); BONDING INTERFACES; BONDING STRENGTH; CNT DISPERSION; CRITICAL CHALLENGES; DISPERSION METHODS; INTERNAL THERMAL RESISTANCE; MECHANICAL STIRRING; POLYMER BONDING; THREE DIMENSIONAL (3D) INTEGRATION; THREE DIMENSIONAL INTEGRATION; THROUGH SILICON VIAS; ULTRA-SONICATION;

BUTENES; CARBON; CARBON NANOTUBES; DIFFUSION BONDING; DISPERSIONS; ELECTRIC PROPERTIES; INTEGRATION; INTERFACES (MATERIALS); MECHANICAL PROPERTIES; THREE DIMENSIONAL;

THERMAL CONDUCTIVITY;

EID: 83455211049     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2011.10.010     Document Type: Article

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