Investigations of carbon nanotubes epoxy composites for electronics packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1731-1736

  Heimann, Matthias ^a   Wirts Ruetters, Martin ^b   Boehme, Bjoern ^a   Wolter, Klaus Juergen ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^b FRAUNHOFER INSTITUTE FOR MANUFACTURING TECHNOLOGY AND ADVANCED MATERIALS IFAM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ABS RESINS; ADHESIVES; CARBON; CARBON CARBON COMPOSITES; CHEMICAL VAPOR DEPOSITION; COMPUTER NETWORKS; DISPERSION (WAVES); ELECTRIC CONDUCTIVITY; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; EPOXY RESINS; HYDRODYNAMICS; JOINING; MATRIX ALGEBRA; MECHANICAL PROPERTIES; NANOCOMPOSITES; NANOPORES; NANOSTRUCTURED MATERIALS; NANOSTRUCTURES; NANOTUBES; OZONE; PACKAGING MATERIALS; PLASMA APPLICATIONS; PLASMAS; POLYMERS; RESINS; TECHNOLOGY; THERMODYNAMIC PROPERTIES; ULTRASONICS; VISCOSITY;

ELECTRONIC COMPONENTS; NEW MATERIALS; PACKAGING INDUSTRIES;

CARBON NANOTUBES;

EID: 51349135890     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550214     Document Type: Conference Paper

References (9)

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