Synthesis of high-quality vertically aligned carbon nanotubes on bulk copper substrate for thermal management

IEEE Transactions on Advanced Packaging

Volumn 33, Issue 2, 2010, Pages 370-376

  Lin, Wei ^a   Zhang, Rongwei ^a   Moon, Kyoung Sik ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Carbon nanotube; Chemical vapor deposition (CVD); Thermal interface materials

Indexed keywords

COMMERCIAL APPLICATIONS; COPPER SUBSTRATES; HIGH QUALITY; MICROELECTRONIC PACKAGING; SCANNING ELECTRON MICROSCOPE; SUPPORT LAYER; THERMAL INTERFACE MATERIALS; THERMAL MANAGEMENT; TRANSMISSION ELECTRON MICROSCOPE; VERTICALLY ALIGNED CARBON NANOTUBE;

ALIGNMENT; CARBON NANOTUBES; CHIP SCALE PACKAGES; COPPER; ELECTRON MICROSCOPES; MICROELECTRONICS; PACKAGING MATERIALS; RAMAN SPECTROSCOPY; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; SYNTHESIS (CHEMICAL); TEMPERATURE CONTROL; THERMAL INSULATING MATERIALS; TRANSMISSION ELECTRON MICROSCOPY;

CHEMICAL VAPOR DEPOSITION;

EID: 77952012049     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2009.2034335     Document Type: Article

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