Carbon nanotube enhanced thermally and electrically conductive adhesive for advanced packaging

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Volumn , Issue , 2010, Pages 438-441

  Tang, Xinhe ^a   Reiter, Werner ^a   Meyer, Andreas ^b   Tse, Kalvin Ka Chun ^a   Hammel, Ernst ^a  

^a Electrovac AG   (Austria)

^b Curamik Electronics GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHERENCE STRENGTH; ADHESIVE PERFORMANCE; ADVANCED PACKAGING; BONDLINE THICKNESS; CERAMIC SUBSTRATES; COPPER FOILS; DEGRADATION TEMPERATURES; DISPERSION PARAMETERS; ELECTRICAL AND MECHANICAL PROPERTIES; ELECTRICALLY CONDUCTIVE ADHESIVES; FINE STRUCTURES; GLASS TRANSITION TEMPERATURE; MANUFACTURE PROCESS; MATRIX; NEW APPLICATIONS; PEELING STRENGTH; POST TREATMENT; POST-CURING; SCREEN-PRINTED; THERMAL RESISTANCE; THERMAL SHOCK CYCLING; UNIFORM DISPERSIONS; UNIFORM DISTRIBUTION;

CARBON NANOTUBES; CERAMIC MATERIALS; CHIP SCALE PACKAGES; DISPERSIONS; ELECTRIC PROPERTIES; EPOXY RESINS; GLASS; MECHANICAL PROPERTIES; PACKAGING; RESINS; SUBSTRATES; TEMPERATURE; VISCOSITY;

GLASS TRANSITION;

EID: 78449278699     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2010.5582881     Document Type: Conference Paper

References (6)

1. P. Kim et al., "Thermal transport measurements of individual multiwalled nanotubes", Phys. Rev. Lett. 87, 215502 (2001)
2. Xu et al, "Enhancement of thermal interface materials with carbon nanotube arrays", International Journal of Heat and Mass Transfer, Vol. 49, No 9-10, (2006), pp. 1658-1666
3. S. Demoustier, private communication on EU project "Nanopack", Feb. 2010
4. X. Tang, E. Hammel et al, "Study of Carbon Nanofiber Dispersion for Application of Advanced Thermal Interface Materials", Proceedings of 1st Vienna International Conference Micro-and Nano-Technology, 395-400, March 9-11, 2005, Vienna, Austria
5. E. Hammel, X. Tang et al, "Performance of Carbon Nanofiber Based Thermal Grease", IMAPS Advanced Technology Workshop on Thermal Management for High-Performance Computing and Wireless Application, Oct. 24-26, 2005, Palo Alto, CA, USA
6. X. Tang, E. Hammel and W. Reiter, "Carbon Nanotube Enhanced Thermally Conductive Phase Change Material For Heat Dissipation", Therminic 2009, 7-9 October 2009, Leuven, Belgium