CMOS-based high-density silicon microprobe arrays for electronic depth control in intracortical neural recording

Journal of Microelectromechanical Systems

Volumn 20, Issue 6, 2011, Pages 1439-1448

  Seidl, Karsten ^a   Herwik, Stanislav ^a   Torfs, Tom ^b   Neves, Herc P ^b   Paul, Oliver ^a   Ruther, Patrick ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

^b IMEC   (Belgium)

Author keywords

3 D probe arrays; CMOS circuitry; electrode selection; high density electrode array; microelectromechanical systems (MEMS) fabrication; neural recording; post CMOS fabrication; silicon microprobes

Indexed keywords

CMOS CIRCUITRY; ELECTRODE SELECTION; HIGH-DENSITY; NEURAL RECORDINGS; POST-CMOS; PROBE ARRAY;

ELECTRODES; FABRICATION; MEMS; MICROELECTROMECHANICAL DEVICES; NEUROPHYSIOLOGY; TISSUE;

PROBES;

EID: 82455171958     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2011.2167661     Document Type: Article

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