An interconnect for out-of-plane assembled biomedical probe arrays

Journal of Micromechanics and Microengineering

Volumn 18, Issue 6, 2008, Pages

  Aarts, A A A ^a,b   Neves, H P ^a   Puers, R P ^b   Van Hoof, C ^a,b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

BUTENES; COMPOSITE MICROMECHANICS; ELECTROMECHANICAL DEVICES; ELECTRONIC EQUIPMENT TESTING; FLIP CHIP DEVICES; GOLD DEPOSITS; MEMS;

BENZOCYCLOBUTENE; CAVITY WALLS; ELECTRICAL CONTACTS; INTERCONNECT SYSTEMS; MEMS STRUCTURES; MICRO PROBES; MICRO-ELECTRO-MECHANICAL SYSTEMS; MODULAR APPROACHES; PLANARIZATION TECHNIQUES; PROBE ARRAYS; RESISTANCE MEASUREMENTS; SACRIFICIAL MATERIALS; TEST STRUCTURES;

MICROELECTROMECHANICAL DEVICES;

EID: 57249101937     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/6/064004     Document Type: Conference Paper

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