Copper electroless bonding of dome-shaped pillars for chip-to-package interconnect

Journal of the Electrochemical Society

Volumn 158, Issue 12, 2011, Pages

  Koo, Hyo Chol ^a   Saha, Rajarshi ^a   Kohl, Paul A ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP TO PACKAGES; ELECTROLESS; ELECTROPLATED COPPER; ELECTROPLATING BATH; JOINING PROCESS; TRITON X-100; TWO-COMPONENT; VOID FORMATION;

COPPER; DOMES; ELECTROLESS PLATING; SURFACE ACTIVE AGENTS;

ELECTROPLATING;

EID: 81355132443     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/2.066112jes     Document Type: Article

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