Low temperature copper to copper direct bonding

Japanese Journal of Applied Physics, Part 2: Letters

Volumn 37, Issue 9 PART A/B, 1998, Pages

  Li, Yang Albert ^a   Bower, Robert W ^a   Bencuya, Izak ^b  

^a University of California   (United States)

^b FAIRCHILD SEMICONDUCTOR   (United States)

Author keywords

Copper; Direct bonding; Integrated circuits; Metal; Silicon

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; COPPER; INTEGRATED CIRCUITS; INTERFACES (MATERIALS); LOW TEMPERATURE EFFECTS; MATERIALS TESTING; SEMICONDUCTING SILICON; SPUTTERING; SURFACE TREATMENT;

ROOT MEAN SQUARE ROUGHNESS; STRAIGHT PULL TEST; SURFACE PLANARIZATION;

BONDING;

EID: 0032154661     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.37.l1068     Document Type: Article

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