SCOPUS 정보 검색 플랫폼

Journal of the Electrochemical Society

Volumn 158, Issue 11, 2011, Pages

Thermal stability and performance of NbSiTaTiZr high-entropy alloy barrier for copper metallization

(7) Tsai, Ming Hung a,b Wang, Chun Wen c Tsai, Che Wei a Shen, Wan Jui a Yeh, Jien Wei a Gan, Jon Yiew a Wu, Wen Wei c

a NATIONAL TSING HUA UNIVERSITY (Taiwan)

b North Carolina State University (United States)

c NATIONAL CHIAO TUNG UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER METALLIZATION; CU METALLIZATION; HIGH ENTROPY ALLOYS; HIGH TEMPERATURE; MICROELECTRONICS INDUSTRY;

CERAMIC MATERIALS; CHEMICAL STABILITY; METALLIZING; MICROELECTRONICS; THERMODYNAMIC STABILITY;

DIFFUSION BARRIERS;

EID: 80054028849 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/2.056111jes Document Type: Article

Times cited : (185)

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