SCOPUS 정보 검색 플랫폼

Materials Chemistry and Physics

Volumn 125, Issue 1-2, 2011, Pages 5-8

(AlCrTaTiZr)N/(AlCrTaTiZr)N0.7 bilayer structure of high resistance to the interdiffusion of Cu and Si at 900 °c

(2) Chang, Shou Yi a Chen, Dao Sheng a

a NATIONAL CHUNG HSING UNIVERSITY (Taiwan)

Author keywords

Diffusion; Nitrides; Thin films

Indexed keywords

AMORPHOUS STRUCTURES; BI-LAYER; BI-LAYER STRUCTURE; CU FILMS; CU-INTERCONNECTS; DIFFUSION RESISTANCE; HIGH RESISTANCE; HIGH TEMPERATURE; INTER-DIFFUSION; MULTICOMPONENTS; NANO-COMPOSITE STRUCTURE; STACK STRUCTURE;

COPPER; NANOCOMPOSITES; NITRIDES; SILICIDES; THIN FILMS;

DIFFUSION BARRIERS;

EID: 78049292751 PISSN: 02540584 EISSN: None Source Type: Journal
DOI: 10.1016/j.matchemphys.2010.09.016 Document Type: Article

Times cited : (21)

References (22)

1
- 0041996796
- D.J. Kim, Y.T. Kim, and J.W. Park J. Appl. Phys. 82 1997 4847
- (1997) J. Appl. Phys. , vol.82 , pp. 4847
- Kim, D.J.¹ Kim, Y.T.² Park, J.W.³

2
- 0032097699
- T. Kouno, H. Niwa, and M. Yamada J. Electrochem. Soc. 145 1998 2164
- (1998) J. Electrochem. Soc. , vol.145 , pp. 2164
- Kouno, T.¹ Niwa, H.² Yamada, M.³

3
- 4644368968
- E. Zschech K. Wetzig, C.M. Schneider, Metal Based Thin Films for Electronics 2003 Wiley-VCH GmbH and Co. KGaA Weinheim, Germany p. 222
- (2003) Metal Based Thin Films for Electronics
- Zschech, E.¹

4
- 31644437457
- R. Hübner, M. Hecker, N. Mattern, V. Hoffmann, K. Wetzig, H. Heuer, Ch. Wenzel, H.-J. Engelmann, D. Gehre, and E. Zschech Thin Solid Films 500 2006 259
- (2006) Thin Solid Films , vol.500 , pp. 259
- Hübner, R.¹ Hecker, M.² Mattern, N.³ Hoffmann, V.⁴ Wetzig, K.⁵ Heuer, H.⁶ Wenzel, C.⁷ Engelmann, H.-J.⁸ Gehre, D.⁹ Zschech, E.¹⁰

5
- 33646391224
- S.H. Kwon, O.K. Kwon, J.S. Min, and S.W. Kang J. Electrochem. Soc. 153 2006 G578
- (2006) J. Electrochem. Soc. , vol.153 , pp. 578
- Kwon, S.H.¹ Kwon, O.K.² Min, J.S.³ Kang, S.W.⁴

6
- 33846958725
- S. Rawal, D.P. Norton, H. Ajmera, T.J. Anderson, and L. McElwee-White Appl. Phys. Lett. 90 2007 051913
- (2007) Appl. Phys. Lett. , vol.90 , pp. 051913
- Rawal, S.¹ Norton, D.P.² Ajmera, H.³ Anderson, T.J.⁴ McElwee-White, L.⁵

7
- 43049105801
- C.W. Chen, J.S. Chen, and J.S. Jeng J. Electrochem. Soc. 155 2008 H438
- (2008) J. Electrochem. Soc. , vol.155 , pp. 438
- Chen, C.W.¹ Chen, J.S.² Jeng, J.S.³

8
- 33646131179
- X.P. Qu, J.J. Tan, M. Zhou, T. Chen, Q. Xie, G.P. Ru, and B.Z. Li Appl. Phys. Lett. 88 2006 151912
- (2006) Appl. Phys. Lett. , vol.88 , pp. 151912
- Qu, X.P.¹ Tan, J.J.² Zhou, M.³ Chen, T.⁴ Xie, Q.⁵ Ru, G.P.⁶ Li, B.Z.⁷

9
- 35548933723
- P. Majumder, and C.G. Takoudis Appl. Phys. Lett. 91 2007 162108
- (2007) Appl. Phys. Lett. , vol.91 , pp. 162108
- Majumder, P.¹ Takoudis, C.G.²

10
- 38549135937
- Y. Wang, F. Cao, Y.T. Liu, and M.H. Ding Appl. Phys. Lett. 92 2008 032108
- (2008) Appl. Phys. Lett. , vol.92 , pp. 032108
- Wang, Y.¹ Cao, F.² Liu, Y.T.³ Ding, M.H.⁴

11
- 41049090037
- L.C. Leu, D.P. Norton, L. McElwee-White, and T.J. Anderson Appl. Phys. Lett. 92 2008 111917
- (2008) Appl. Phys. Lett. , vol.92 , pp. 111917
- Leu, L.C.¹ Norton, D.P.² McElwee-White, L.³ Anderson, T.J.⁴

12
- 2942717044
- J.W. Yeh, S.K. Chen, S.J. Lin, J.Y. Gan, T.S. Chin, T.T. Shun, C.H. Tsau, and S.Y. Chang Adv. Eng. Mater. 6 2004 299
- (2004) Adv. Eng. Mater. , vol.6 , pp. 299
- Yeh, J.W.¹ Chen, S.K.² Lin, S.J.³ Gan, J.Y.⁴ Chin, T.S.⁵ Shun, T.T.⁶ Tsau, C.H.⁷ Chang, S.Y.⁸

13
- 17744391818
- C.J. Tong, Y.L. Chen, S.K. Chen, J.W. Yeh, T.T. Shun, C.H. Tsau, S.J. Lin, and S.Y. Chang Metall. Mater. Trans. A 36 2005 881
- (2005) Metall. Mater. Trans. A , vol.36 , pp. 881
- Tong, C.J.¹ Chen, Y.L.² Chen, S.K.³ Yeh, J.W.⁴ Shun, T.T.⁵ Tsau, C.H.⁶ Lin, S.J.⁷ Chang, S.Y.⁸

14
- 21244482636
- C.J. Tong, M.R. Chen, S.K. Chen, J.W. Yeh, T.T. Shun, S.J. Lin, and S.Y. Chang Metall. Mater. Trans. A 36 2005 1263
- (2005) Metall. Mater. Trans. A , vol.36 , pp. 1263
- Tong, C.J.¹ Chen, M.R.² Chen, S.K.³ Yeh, J.W.⁴ Shun, T.T.⁵ Lin, S.J.⁶ Chang, S.Y.⁷

15
- 29744449685
- Y.Y. Chen, U.T. Hong, J.W. Yeh, and H.C. Shih Appl. Phys. Lett. 87 2005 261918
- (2005) Appl. Phys. Lett. , vol.87 , pp. 261918
- Chen, Y.Y.¹ Hong, U.T.² Yeh, J.W.³ Shih, H.C.⁴

16
- 33750977263
- C.H. Lai, S.J. Lin, J.W. Yeh, and S.Y. Chang Surf. Coat. Technol. 201 2006 3275
- (2006) Surf. Coat. Technol. , vol.201 , pp. 3275
- Lai, C.H.¹ Lin, S.J.² Yeh, J.W.³ Chang, S.Y.⁴

17
- 38949121180
- M.H. Tsai, C.W. Wang, C.H. Lai, J.W. Yeh, and J.Y. Gan Appl. Phys. Lett. 92 2008 052109
- (2008) Appl. Phys. Lett. , vol.92 , pp. 052109
- Tsai, M.H.¹ Wang, C.W.² Lai, C.H.³ Yeh, J.W.⁴ Gan, J.Y.⁵

18
- 65649120092
- S.Y. Chang, and M.K. Chen Thin Solid Films 517 2009 4961
- (2009) Thin Solid Films , vol.517 , pp. 4961
- Chang, S.Y.¹ Chen, M.K.²

19
- 63649149591
- S.Y. Chang, M.K. Chen, and D.S. Chen J. Electrochem. Soc. 156 2009 G37
- (2009) J. Electrochem. Soc. , vol.156 , pp. 37
- Chang, S.Y.¹ Chen, M.K.² Chen, D.S.³

20
- 20344396562
- S. Haukka, K.E. Elers, and M. Tuominen Mater. Res. Soc. Symp. Proc. 612 2001 D6
- (2001) Mater. Res. Soc. Symp. Proc. , vol.612 , pp. 6
- Haukka, S.¹ Elers, K.E.² Tuominen, M.³

21
- 0033907537
- A. Inoue Acta Mater. 48 2000 279
- (2000) Acta Mater. , vol.48 , pp. 279
- Inoue, A.¹

22
- 77958537874
- A. Kohn, and M. Eizenberg Y. Shacham-Diamand, T. Osaka, M. Datta, T. Ohba, Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications 2009 Springer New York 93 120
- (2009) Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications , pp. 93-120
- Kohn, A.¹ Eizenberg, M.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.