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Journal of Electronic Materials

Volumn 40, Issue 9, 2011, Pages 1895-1902

Correlation between Sn grain orientation and corrosion in Sn-Ag-Cu solder interconnects

(5) Lee, Tae Kyu a Liu, Bo a Zhou, Bite b Bieler, Thomas b Liu, Kuo Chuan a

a CISCO SYSTEMS (United States)

b Michigan State University (United States)

Author keywords

corrosion; orientation image microscopy (OIM); Pb free solder; salt spray; Sn grain orientation; thermal fatigue

Indexed keywords

BASAL PLANES; CORROSION ATTACK; CORROSION PATH; CRITICAL LOCATION; GRAIN ORIENTATION; INTERCONNECT RELIABILITY; MARINE ENVIRONMENT; ORIENTATION IMAGE MICROSCOPY (OIM); ORIENTATION IMAGING MICROSCOPY; PB-FREE SOLDER; PRE-TREATMENT; SALT SPRAY; SN GRAIN ORIENTATION; SN GRAINS; SN-AG-CU; SNAGCU SOLDER; SOLDER JOINTS; STRONG CORRELATION; WAFER LEVEL PACKAGE;

COPPER ALLOYS; CORROSION; CORROSION FATIGUE; LEAD; SILVER; SILVER ALLOYS; SODIUM CHLORIDE; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 80051593635 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-011-1654-5 Document Type: Article

Times cited : (20)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.