Micromachining of pyrex 7740 glass by silicon molding and vacuum anodic bonding

Journal of Microelectromechanical Systems

Volumn 20, Issue 4, 2011, Pages 909-915

  Liu, Junwen ^a   Shang, Jintang ^a   Tang, Jieying ^a   Huang, Qing An ^a  

^a Southeast University   (China)

Author keywords

Anodic bonding; glass; micromachining; wafer level packaging

Indexed keywords

ANODIC BONDING; ANODIC BONDING PROCESS; BONDED WAFERS; BONDING STRENGTH; DEEP CAVITY; FABRICATION PROCESS; GLASS WAFER; LEAKAGE RATES; MEMSDEVICES; PROCESSING PARAMETERS; PYREX 7740 GLASS; REGULAR ARRAY; SINGLE CHIPS; SOFTENING POINTS; VACUUM ANODIC BONDING; WAFER LEVEL PACKAGING; WAFER LEVEL PROCESSING; WAFER-LEVEL HERMETIC PACKAGING;

COMPOSITE MICROMECHANICS; ELECTRONICS PACKAGING; FABRICATION; GLASS; MICROMACHINING; MOLDING; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; VACUUM; WAFER BONDING;

GLASS BONDING;

EID: 79961209536     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2011.2160043     Document Type: Article

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