Fabrication and characterization of a wafer-level MEMS vacuum package with vertical feedthroughs

Journal of Microelectromechanical Systems

Volumn 17, Issue 1, 2008, Pages 193-200

  Chae, Junsoek ^a   Giachino, Joseph M ^b   Najafi, Khalil ^b  

^a Arizona State University   (United States)

^b UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Package; Pirani; Vacuum; Vertical feedthrough

Indexed keywords

FLIP CHIP DEVICES; PRESSURE MEASUREMENT; VACUUM GAGES;

PIRANI GAUGE; VACUUM/HERMETIC CAPABILITY; VERTICAL FEEDTHROUGH;

MEMS;

EID: 40449130821     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2007.910258     Document Type: Article

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