Deep microstructuring in glass for microfluidic applications

Microsystem Technologies

Volumn 13, Issue 5-6, 2007, Pages 447-453

  Khan Malek, Chantal ^a   Robert, Laurent ^a   Boy, Jean Jacques ^a   Blind, Pascal ^a,b  

^a FEMTO ST INSTITUTE   (France)

^b Centre de Transfert en Micro et Nanotechnologies (CTMN)   (France)

Author keywords

[No Author keywords available]

Indexed keywords

BOROSILICATE GLASS; ETCHING; FLUIDIC DEVICES; PHOTOLITHOGRAPHY; SURFACE PROPERTIES; ULTRASONICS;

MICRO-TOTAL-ANALYSIS-SYSTEMS; MICROFLUIDIC APPLICATIONS; STRUCTURING TECHNIQUES;

MICROSTRUCTURE;

EID: 33847250366     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-006-0185-0     Document Type: Article

References (31)

1. Andrey E, Boy JJ, Petrini V, Khan-Malek C (2004) Developments in micro-ultrasonic machining (Micro-USM). In: Proceedings of the 4th EUSPEN international conference, Glasgow, pp 191-192
2. Andrey E, Boy JJ, Khan Malek C (2005) Tool wear for microultrasonic machining (MUSM). In: Proceedings of the 5th EUSPEN international conference, Montpellier, 1:345-348
3. Becker H, Arundell M, Harnisch A, Hülsenberg D (2002) Chemical analysis in photostructurable glass chips. Sens Actuators B 86:271-279
4. Belloy E, Thurre S, Walckiers E, Sayah A, Gijs MAM (2000) The introduction of powder blasting for sensor and microsystem applications. Sens Actuators A 84:330-337
5. Brokmann U, Jacquorie M, Talkenberg M, Harnisch A, Kreutz E-W, Hülsenberg D, Poprawe R (2002) Exposure of photosensitive glasses with pulsed UV-laser radiation. Microsyst Technol 8:102-104
6. Bu M, Melvin T, Ensell GJ, Wilkinson JS, Evans AGR (2004) A new masking technology for dep glass etching and its micro-fluidic application. Sens Actuators A 115:476-482
7. Corman T, Enoksson P, Stemme G (1998) Deep wet etching of borosilicate glass using an anodically bonded silicon substrate. J Micromech Microeng 8:84-87
8. Daridon A, Fascio V, Lichtenberg J, Wütrig R, Langen H, Verpoorte E, de Rooij N (2001) F Multi-layer microfluidic glass chips for microanalytical applications. Fresenius J Anal Chem 371:261-269
9. Dietrich TR, Ehrfeld W, Lacher M, Kramer M, Speit B (1996) Fabrication technologies for microsystems utilizing photoetchable glass. Microelectron Eng 30:497-504
10. Etoh S, Fujimura T, Hattori R, Kuroki Y (2003) Fabrication of on-chip microcapillary using photosensitive glass. Microsyst Technol 9:541-545
11. Freitag A, Vogel D, Scholz R, Dietrich TR (2001) Microfluidic devices made of glass. J Assoc Lab Autom 6(4):45-49
12. Gimkiewicz C, Gerhard E (1997) High-aspect micro-wing wheels in photosensitive glass. Microsyst Technol 4:40-45
13. Grétillat MA, Paoletti F, Thiébaud P, Roth S, Koudelka-Hep M, de Rooij NF (1997) A new fabrication method for borosilicate glass capillary tubes with lateral insets and outlets. Sens Actuators A 60:219-222
14. Hülsenberg D (1997) Glasses for microsystem technology. J Microelectron 28:419-432
15. Iliescu C, Miao J, Tay FEH (2005) Stress control in masking layers for deep wet micromachining of Pyrex glass. Sens Actuators A 117:286-292
16. 6 plasma. Sens Actuators A 87:139-145
17. Lin C, Lee G, Lin Y, Chang G (2001) A fast protyping process for fabrication of microfluidic systems on soda-lime glass. J Micromech Microeng 11:726-732
18. Masuda M, Sugioka K, Cheng Y, Aoki N, Kawachi M, Shihoyama K, Toyoda K, Helvajian H, Midorikawa K (2003) 3D micro-structuring inside photosensitive glass by femtosecond laser excitation. Appl Phys A 76:857-860
19. Merz P, Quenzer HQ, Bernt H, Wagner B, Zoberbier M (2003) A novel micromachining technology for structuring borosilicate glass substrates. In: IEEE proceedings of the 12th international conference on solid state sensors, actuators and microsystems, Boston, June 2003, pp 258-261
20. Morgan CJ, Wallance RR, Marsh ER (2004) Micro machining glass with polycrystalline diamond tools shaped by micro electro discharge machining. J Micromech Microeng 14:1687-1692
21. Mori R, Matsumoto Y (2003) Three-dimensional micro-capillaries formed by gray-scale lithography of photosensitive glass. In: Proceedings of the μTAS Squaw Valley, California, Oct 2003, pp 203-206
22. Moronuki N, Brinksmeier E (2002) Micromachining of brittle materials by ultrasonic lapping with tool wear compensation. In: Proceedings of the 3rd EUSPEN international conference, Eindhoven, The Netherlands, pp 399-402
23. Mourzina Y, Steffen A, Offenhäusser A (2005) The evaporated metal masks for chemical glass etching for BioMEMS. Microsyst Technol 11:135-140
24. Nikumb S, Chen Q, Li C, Reshef H, Zheng HY, Qiu H, Low D (2005) Precision glass machining, drilling and profile cutting by short pulse laser. Thin Solid Films 477:216-221
25. Petersen D, Mogensen KB, Klank H (2004) Glass micromachining. In: Geschke O, Klank H, Tellemann P (eds) Microsystem engineering of lab-on-a-chip devices, Chap 7. Wiley-VCH, New York, p 161
26. Plaza JA, Lopez MJ, Moreno A, Duch M, Cane C (2003) Definition of high aspect ratio columns. J Sens Actuators A 105:305-310
27. Rozenberg et al (1973) Physical principles of ultrasonics technology. Ultrasonic cutting, Part 1, Consultants Bureau, New York
28. Schlautmann S, Wensink H, Schasfoort R, Elwenspoek M, van der Berg A (2001) Powder-blasting technology as an alternative tool for microfabrication of capillary electrophoresis chips with integrated conductivity sensors. J Micromech Microeng 11:386-389
29. Slikkerveer PJ, Bouten PCP, de Haas FMC (2000) High quality mechanical etching of brittle materials by powder blasting. Sens Actuators A 85:296-303
30. Stjernstrom M, Roeraade J (1998) Method for fabrication of microfluidic system in glass. J Micromech Microeng 8:33-38
31. Yan BH, Wang AC, Huang CY, Huang FY (2002) Study of precision micro-holes in borosilicate glass using micro EDM combined with micro ultrasonic vibration machining. Int J Mach Tools Manuf 42:1105-1112