Hot-forming of micro glass cavities for MEMS wafer level hermetic packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 840-845

  Shang, Jintang ^a   Liu, Junwen ^a   Xu, Chao ^a   Zhang, Di ^a   Cheng, Boying ^a   Huang, Qing An ^a   Tang, Jieying ^a  

^a Southeast University   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BONDED WAFERS; CAVITY PRESSURE; FILLING RATE; FORMING PROCESS; FORMING TEMPERATURE; GLASS WAFER; HERMETIC PACKAGING; LEAKAGE RATES; LOW COSTS; LOW-COST LASERS; MEMSDEVICES; MOVING PARTS; PROCESSING TIME; SINGULATION; VACUUM PACKAGING; WAFER LEVEL; WAFER LEVEL PACKAGING; WAFER-LEVEL HERMETIC PACKAGING;

GLASS; PACKAGING; WAFER BONDING;

ELECTRONICS PACKAGING;

EID: 77955225219     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490715     Document Type: Conference Paper

References (7)

1. Najafi K, "Micro packaging technologies for integrated microsystems," applications to MEMS and MOEMS Proc., 2003, SPIE 4982 9-27.
2. Li X, Abe T, Esashi M, "Deep reactive ion etching of Pyrex glass using SF6 plasma," Sens Actuators A, 2001, 87:139-145.
3. Choa, S. H., "Reliability of vacuum packaged MEMS gyroscopes", Microelectron. Reliability, 45 (2005) 361-369
4. Choa, S. H., "Reliability of MEMS packaging: vacuummaintenance and packaging induced stress", MicrosystTechnol 11 (2005) 1187-1196.
5. Nikumb S, Chen Q, Li C, Reshef H, Zheng HY, Qiu H, Low D, "Precision glass machining, drilling and profile cutting by short pulse laser," Thin Solid Films, 2005, 477:216-221.
6. Eklund, E. J. and A. M. Shkel, "Glass blowing on a wafer level," J. Microelectromech. Syst, 2007, 16:232-239.
7. J. Liu, Q.A. Huang, J. Shang, et al., " Micromachining of Pyrex7740 glass and their applications to wafer-level hermetic packaging of MEMS devices", MEMS2010, 2010, Hong Kong.