Deep wet etching of borosilicate glass using an anodically bonded silicon substrate as mask

Journal of Micromechanics and Microengineering

Volumn 8, Issue 2, 1998, Pages 84-87

  Corman, Thierry ^a   Enoksson, Peter ^a   Stemme, Göran ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; BOROSILICATE GLASS; ETCHING; MASKS; SEMICONDUCTING GLASS; SILICON WAFERS;

ANODIC BONDING; DEEP WET ETCHING; GLASS WAFERS;

MICROELECTRONIC PROCESSING;

EID: 0032090541     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/8/2/010     Document Type: Article

References (8)

1. Hülsenberg D et al 1994 New glasses for microsystem technologies Proc. Micro System Technol. pp 259-68
2. Grétillat M-A, Paoletti F, Thiébaud P, Roth S, Koudelka-Hep M and de Rooij N F 1996 A new fabrication method of borosilicate glass capillary tubes with lateral inlets and outlets Proc. Eurosensors X pp 259-62
3. Flannery A F, Mourlas N J, Storment C W, Tsai S, Tan S H and Kovacs G T A 1997 PECVD silicon carbide for micromachined transducers Proc. Transducers '97 pp 217-20
4. Diepold T and Obermeier E 1995 Smoothing of ultrasonically drilled holes in borosilicate glass by wet chemical etching Proc. MME'95 (Copenhagen) pp 35-8
5. Shoji S, Kikuchi H and Torigoe H 1997 Anodic bonding below 180 °C for packaging and assembling of MEMS using lithium alminosilicate-β-quartz glass-ceramic Proc. MEMS'97 pp 482-7
6. Corman T, Enoksson P and Stemme G 1997 Gas damping of electrostatically excited resonators Sensors Actuators A 61 249-55
7. Shoji S and Esashi M 1990 Photoetching and electrochemical discharge drilling of Pyrex glass Tech. Dig. 9th Sensor Symp. pp 27-30
8. Ko W H, Suminto J T and Yeh G J 1985 Bonding techniques for microsensors Micromachining and Micropackaging of Transducers (Amsterdam: Elsevier) pp 41-61