Micromachining of pyrex7740 glass and their applications to wafer-level hermetic packaging of MEMS devices

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2010, Pages 496-499

  Liu, Junwen ^a   Huang, Qing An ^a   Shang, Jintang ^a   Song, Jing ^a   Tang, Jieying ^a  

^a Southeast University   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ANODIC BONDING; ANODIC BONDING PROCESS; DEEP CAVITY; DEW POINT SENSORS; GLASS WAFER; MEMSDEVICES; PROCESSING PARAMETERS; REGULAR ARRAY; SI SUBSTRATES; WAFER LEVEL; WAFER-LEVEL HERMETIC PACKAGING; WHOLE PROCESS;

BONDING; FUZZY CONTROL; GLASS; MECHANICAL ENGINEERING; MECHANICS; REACTIVE ION ETCHING; SILICON WAFERS; WAFER BONDING;

ELECTRONICS PACKAGING;

EID: 77952756648     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2010.5442456     Document Type: Conference Paper

References (5)

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2. N. Maluf , An Introduction to MEMS Engineering. Boston, MA: Artech House, 2000.
3. Li X, Abe T, Esashi M, "Deep reactive ion etching of pyrex glass using SF6 plasma," Sens Actuators A, 2001, 87:139-145. (Pubitemid 32131575)
4. Nikumb S, Chen Q, Li C, Reshef H, Zheng HY, Qiu H, Low D, "Precision glass machining, drilling and profile cutting by short pulse laser," Thin Solid Films, 2005, 477:216-221. (Pubitemid 40302796)
5. Eklund, E. J. and A. M. Shkel, "Glass blowing on a wafer level," J. Microelectromech. Syst, 2007, 16:232-239.