Evolution of Ag3Sn compounds in solidification of eutectic Sn-3.5Ag solder

2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

Volumn , Issue , 2009, Pages 646-649

  Lee, Hwa Teng ^a   Chen, Yin Fa ^a   Hong, Ting Fu ^b   Shih, Ku Ta ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING RATES; INTERMETALLIC COMPOUNDS; MORPHOLOGY AND SIZE; NEEDLE-LIKE; SN-3.5AG;

COOLING; CRYSTALLIZATION; ELECTRONICS PACKAGING; EUTECTICS; FREEZING; MORPHOLOGY; PACKAGING; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERING ALLOYS; SOLIDIFICATION;

TIN;

EID: 70450002928     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2009.5270669     Document Type: Conference Paper

References (12)

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