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Microelectronic Engineering

Volumn 84, Issue 2, 2007, Pages 328-335

Effect of substrate metallization on interfacial reactions and reliability of Sn-Zn-Bi solder joints

(2) Sharif, Ahmed a Chan, Y C a

a CITY UNIVERSITY OF HONG KONG (Hong Kong)

Author keywords

Dissolution; Intermetallic compounds; Sn Zn Bi lead free solder; Under bump metallization

Indexed keywords

DISSOLUTION; ELECTROLYSIS; INTERFACES (MATERIALS); INTERMETALLICS; SOLDERED JOINTS; SUBSTRATES;

LIQUID STATE ANNEALING; SN-ZN-BI LEAD FREE SOLDER; UNDER BUMP METALLIZATION;

METALLIZING;

EID: 33846191172 PISSN: 01679317 EISSN: None Source Type: Journal
DOI: 10.1016/j.mee.2006.10.087 Document Type: Article

Times cited : (40)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.