SCOPUS 정보 검색 플랫폼

Volumn 23, Issue 7, 1994, Pages 595-601

A viable tin-lead solder substitute: Sn-Ag-Cu

(3) Miller, Chad M a Anderson, Iver E a Smith, Jack F a

Author keywords

Differential thermal analysis; lead free solder; scanning electron microscopy tin silver copper eutectic; wavelength dispersive spectrometry; x ray diffraction

Indexed keywords

EID: 51649133658 PISSN: 03615235 EISSN: 1543186X Source Type: Journal
DOI: 10.1007/BF02653344 Document Type: Article

Times cited : (268)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.