A comparison between fine-grained and nanocrystalline electrodeposited Cu-Ni films. Insights on mechanical and corrosion performance

Surface and Coatings Technology

Volumn 205, Issue 23-24, 2011, Pages 5285-5293

  Pellicer, E ^a   Varea, A ^a   Pane S ^b   Sivaraman, K M ^b   Nelson, B J ^b   Surinach S ^a   Baro M D ^a   Sort, J ^a  

^a UNIVERSITAT AUTÒNOMA DE BARCELONA   (Spain)

^b ETH ZURICH   (Switzerland)

Author keywords

Copper nickel alloy; Corrosion; Electrodeposition; Mechanical properties; Nanocrystalline films

Indexed keywords

CHLORIDE MEDIA; COPPER NICKEL ALLOYS; CORROSION CURRENT DENSITIES; CORROSION PERFORMANCE; CORROSION POTENTIALS; CRYSTAL SIZE; CU-NI ALLOYS; EFFECTIVE TOOL; ELASTIC RECOVERY; ELECTROLYTIC SOLUTION; FINE-GRAINED FILMS; GRAIN REFINING; MICROSTRAINS; NANO-STRUCTURING; NANOCRYSTALLINE FILMS; NANOCRYSTALLINES; NEGATIVE VALUES; NI FILMS; OVERALL PROPERTIES;

CHLORINE COMPOUNDS; COPPER ALLOYS; CORROSION RESISTANCE; CRYSTALLITE SIZE; ELECTRODEPOSITION; HARDNESS; NANOCRYSTALLINE ALLOYS; NICKEL ALLOYS; STACKING FAULTS; SURFACE ROUGHNESS; WEAR RESISTANCE; X RAY DIFFRACTION;

COPPER;

EID: 79960699579     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2011.05.047     Document Type: Article

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