Saccharin effects on direct-current electroplating nanocrystalline Ni-Cu alloys

Journal of the Electrochemical Society

Volumn 155, Issue 9, 2008, Pages

  Cui, Xinwei ^a   Chen, Weixing ^a  

^a UNIVERSITY OF ALBERTA   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYS; CHLORINE COMPOUNDS; CLADDING (COATING); COATINGS; COPPER; CURRENT DENSITY; DENDRITES (METALLOGRAPHY); ELECTROPLATING; GRAIN SIZE AND SHAPE; METALLIC COMPOUNDS; METALLIZING; NANOCRYSTALLINE ALLOYS; NANOCRYSTALLINE MATERIALS; NANOSTRUCTURED MATERIALS; NICKEL; NICKEL ALLOYS; SEDIMENTATION; SEDIMENTOLOGY; SUGARS; X RAY DIFFRACTION ANALYSIS;

CO-DEPOSITION; COATING SURFACES; CU CONTENT; DENDRITE GROWTH; DENDRITE STRUCTURES; DIRECT CURRENTS; ELECTRON MICROSCOPY ANALYSIS; GRAIN SIZES; IMPEDANCE ANALYSIS; NANO PHASE; NANO-CRYSTALLINE; NANO-SIZED; NI-CU ALLOYS; PLATED COATINGS; STEADY-STATE POLARIZATION; SURFACE FINISHING; X-RAY DIFFRACTION;

COPPER ALLOYS;

EID: 49149095344     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2948362     Document Type: Article

References (22)

1. G. Hodes, Electrochemistry of Nanomaterials, p. 67, Wiley-VCH, Weinheim, Germany (2001).
2. S. Tao and D. Y. Li, Nanotechnology NNOTER 0957-4484 10.1088/0957-4484/ 17/1/012, 17, 65 (2006).
3. S. K. Ghosh, G. K. Dey, R. O. Dusane, and A. K. Grover, J. Alloys Compd. JALCEU 0925-8388 10.1016/j.jallcom.2005.12.094, 426, 235 (2006).
4. D. Kim, D. -Y. Park, B. Y. Yoo, P. T. A. Sumodjo, and N. V. Myung, Electrochim. Acta ELCAAV 0013-4686 10.1016/S0013-4686(02)00773-9, 48, 819 (2003).
5. M. -S. Löffler, H. Natter, R. Hempelmann, and K. Wippermann, Electrochim. Acta ELCAAV 0013-4686 10.1016/S0013-4686(03)00375-X, 48, 3047 (2003).
6. D. -Y. Park, N. V. Myung, M. Schwartz, and K. Nobe, Electrochim. Acta ELCAAV 0013-4686 10.1016/S0013-4686(02)00160-3, 47, 2893 (2002).
7. I. Kazeminezhad and W. Schwarzacher, J. Solid State Electrochem. JSSEFS 1432-8488 10.1007/s10008-003-0422-8, 8, 187 (2004).
8. R. Orlňáková, A. Turoňová, D. Kladeková, M. Gálová, and R. M. Smith, J. Appl. Electrochem. JAELBJ 0021-891X 10.1007/s10800-006-9162-7, 36, 957 (2006).
9. I. Baskaran, T. S. N. Sankara Narayanan, and A. Stephen, Mater. Lett. MLETDJ 0167-577X 10.1016/j.matlet.2005.12.065, 60, 1990 (2006).
10. S. K. Ghosh, A. K. Grover, G. K. Dey, and M. K. Totlani, Surf. Coat. Technol. SCTEEJ 0257-8972 10.1016/S0257-8972(00)00520-X, 126, 48 (2000).
11. S. K. Ghosh and A. K. Grover, J. Mater. Res., 21, 45 (2006). 0884-2914
12. M. Ishikawa and H. Enomoto, J. Met. Finish. Soc. Jpn. KZHGAY 0026-0614, 31, 545 (1980).
13. I. Mizushima, M. Chikazawa, and T. Watanabe, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.1836935, 143, 1978 (1996).
14. T. A. Green, A. E. Russel, and S. Roy, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.1838360, 145, 875 (1998).
15. E. Chassaing, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.1401079, 148, C690 (2001).
16. A. M. El-Sherik and U. Erb, J. Mater. Sci. JMTSAS 0022-2461 10.1007/BF00356715, 30, 5743 (1995).
17. S. -H. Kim, H. -J. Sohn, Y. -C. Joo, Y. -W. Kim, T. -H. Yim, H. -Y. Lee, and T. Kang, Surf. Coat. Technol., 199, 43 (2005). 0257-8972
18. L. S. Birks and H. Friedman, J. Appl. Phys. JAPIAU 0021-8979 10.1063/1.1707771, 17, 687 (1946).
19. I. Epelboin, M. Joussellin, and R. Wiart, J. Electroanal. Chem., 119, 61 (1981). 0368-1874
20. E. Chassaing, M. Joussellin, and R. Wiart, J. Electroanal. Chem., 157, 75 (1983). 0368-1874
21. S. W. Watson and R. P. Walters, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.2085471, 138, 3633 (1991).
22. E. Chassaing and K. V. U. Quang, J. Appl. Electrochem. JAELBJ 0021-891X 10.1007/BF01023611, 17, 1267 (1987).