Superplastic extensibility of nanocrystalline copper at room temperature

Science

Volumn 287, Issue 5457, 2000, Pages 1463-1466

  Lu, L ^a   Sui, M L ^a   Lu, K ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; ELECTRODEPOSITION; METALLOGRAPHIC MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; PLASTIC DEFORMATION; SUPERPLASTICITY; SYNTHESIS (CHEMICAL); TENSILE STRESS;

SUPERPLASTIC EXTENSIBILITY;

COPPER;

ARTICLE; ENVIRONMENTAL TEMPERATURE; HARDNESS; PHYSICAL PHENOMENA; PHYSICAL STRESS; PLASTICITY; PRIORITY JOURNAL; SYNTHESIS; ULTRASTRUCTURE;

EID: 0034712068     PISSN: 00368075     EISSN: None     Source Type: Journal    
DOI: 10.1126/science.287.5457.1463     Document Type: Article

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18. Supported by the Chinese Academy of Sciences, the National Science Foundation of China (grants 59431021 and 59625101), and the Ministry of Sciences and Technology of China (grant G1999064505). The authors thank S. L. Gu for his assistance in sample preparation.