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Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 1841-1845

Evaluation of electromigration (EM) life of ENEPIG and CuSOP surface finishes with various solder bump materials

(6) Kim, Dong Wook a Lee, J K Jerry a Lee, Myung June a Pai, S Y a Chen, Stan b Kuo, Frank b

a XILINX INC (United States)

b Silicon Precision Industries Co LTD (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONSUMPTION RATES; CURRENT CROWDING; FAILURE MECHANISM; INPUT CURRENT; PROPAGATION MECHANISM; SOLDER BUMP; SOLDER JOINTS; SURFACE FINISHES; VOID FORMATION;

EUTECTICS; FINISHING; LEAD ALLOYS; SOLDERING; SUBSTRATES; SURFACES; TIN;

FAILURE ANALYSIS;

EID: 77955214641 PISSN: 05695503 EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/ECTC.2010.5490713 Document Type: Conference Paper

Times cited : (9)

References (7)

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2
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.