Deposition of organosilicon coatings by a non-equilibrium atmospheric pressure plasma jet: Design, analysis and macroscopic scaling law of the process

Plasma Processes and Polymers

Volumn 8, Issue 7, 2011, Pages 664-675

  Pulpytel, Jerome ^a   Kumar, Virendra ^a,b   Peng, Pu ^a   Micheli, Victor ^c   Laidani, Nadira ^c   Arefi Khonsari, Farzaneh ^a  

^a PSL RESEARCH UNIVERSITY   (France)

^b BHABHA ATOMIC RESEARCH CENTRE   (India)

^c FONDAZIONE BRUNO KESSLER   (Italy)

Author keywords

atmospheric pressure; plasma jet; silicon oxide

Indexed keywords

AFM; AIR MIXTURES; ATMOSPHERIC PLASMAS; ATMOSPHERIC PRESSURE PLASMA JETS; ATMOSPHERIC PRESSURE PLASMAS; AUGER SPECTROSCOPY; CARBON CONTENT; CHEMICAL COMPOSITIONS; COATING COMPOSITIONS; DEPOSITED FILMS; EMPIRICAL MODEL; GAS PERMEATION; HEXAMETHYL DISILOXANE; HIGH DYNAMIC; HIGH RATE; LITERATURE DATA; NON EQUILIBRIUM; ORGANOSILICONES; PROCESS PARAMETERS; SMOOTH COATINGS; SURFACE ENGINEERING;

ATMOSPHERIC CHEMISTRY; ATMOSPHERIC PRESSURE; ATMOSPHERICS; CARBON FILMS; CORROSION RESISTANCE; DESIGN; DESIGN OF EXPERIMENTS; EXPERIMENTS; GAS PERMEABLE MEMBRANES; MICROELECTRONICS; PLASMA ACCELERATORS; PLASMA JETS; PLASMA SOURCES; PROTECTIVE COATINGS; SCALING LAWS; SILICON COMPOUNDS; SILICON OXIDES;

PLASMA DEPOSITION;

EID: 79960218756     PISSN: 16128850     EISSN: 16128869     Source Type: Journal    
DOI: 10.1002/ppap.201000121     Document Type: Article

References (42)

1. A. Schütze, J. Y. Jeong, E. Babayan, J. Park, G. S. Selwyn, R. F. Hicks, IEEE Trans. Plasma Sci. 1998, 26, 1685.
2. A. Fridman, L. A. Kennedy, (Eds.), Plasma Physics and Engineering, Taylor and Francis, New York 2004.
3. C. Tendero, C. Tixier, P. Triant, J. Desmaison, P. Leprince, Spectrochem. Acta B 2006, 61, 2.
4. M. Laroussi, T. Akan, Plasma Process. Polym. 2007, 4, 777.
5. P. Scopece, A. Viaro, R. Sulcis, I. Kulyk, A. Patelli, M. Guglielmi, Plasma Process. Polym. 2009, 6, S705.
6. A. Pecora, L. Maiolo, G. Fortunato, C. Caligiore, J. Non-Cryst. Solids 2006, 352, 1430.
7. C. Petit-Etienne, M. Tatoulian, I. Mabille, E. Sutter, F. Arefi-Khonsari, Plasma Process. Polym. 2007, 4, S562.
8. U. Lommatzsch, J. Ihde, Plasma Process. Polym. 2009, 6, 642.
9. Practical Experimental Designs for Engineers and Scientist, 3rd edition, W. J. Diamond, Ed., John Wiley and Sons Inc., New York 2001.
10. F. Azarmi, T. W. Coyle, J. Mostaghimi, J. Therm. Spray Technol. 2008, 17, 144.
11. L. P. Yeo, H. Yan, C. Lam, M. B. Chan-Park, Langmuir 2006, 22, 10196.
12. S. P. Kuo, E. Koretzky, R. J. Vidmar, Rev. Sci. Instrum. 1999, 70, 3032.
13. T. P. Kasih, S. I. Kuroda, H. Kubota, Chem. Vap. Deposition. 2007, 13, 169.
14. U. Lommatzsch, J. Ihde, D. Pasedag, H. E. Wagner, Proc. of the Int. Symp. Plasma Chem. (ISPC-17, Kyoto, Japan) 2007.
15. S. M. Adler-Golden, J. Phys. Chem. 1989, 93, 684.
16. Physics of Chemically Active Plasma, V. D. Rusanov, A. Fridman, Eds., Nauka, Moscow 1984.
17. J. Luque, D. R. Crosley, SRI International Report 1999, MP-99-009
18. V. Rohani, G. Bauville, B. Lacour, V. Puech, F. D. Duminica, E. Silberberg, Surf. Coat. Technol. 2008, 203, 862.
19. M. H. Han, J. H. Noh, T. I. Lee, J. H. Choi, K. W. Park, H. S. Hwang, H. K. Baik, Plasma Process. Polym. 2008, 5, 861.
20. J. Benedikt, K. Focke, A. Yanguas-Gil, A. von Keudell, Appl. Phys. Lett. 2006, 89, 251504.
21. Perry's Chemical Engineer's Handbook, 7th edition, R. H. Perry, D. W. Green, Eds. McGraw-Hill Companies, New York 1997.
22. M. Noeske, J. Degenhardt, S. Strudthoff, U. Lommatzsch, Int. J. Adhes. Adhes. 2004, 24, 171.
23. W. Bensch, W. Bergholz, Semicond. Sci. Technol. 1990, 5, 421.
24. J. Schäfer, R. Foest, A. Quade, A. Ohl, K. D. Weltmann, J. Phys. D: Appl. Phys. 2008, 41, 194010.
25. S. J. Bull, Surf. Coat. Technol. 1991, 50, 25.
26. K. Inomata, H. Ha, K. A. Chaudhary, H. Koinuma, Appl. Phys. Lett. 1994, 64, 3.
27. J. Benedikt, V. Raballand, A. Yanguas-Gil, K. Focke, A. von Keudell, Plasma Phys. Control. Fusion 2007, 49, B419.
28. J. Bour, J. Bardon, H. Aubriet, D. Del Frari, B. Verheyde, R. Dams, D. Vangeneugden, D. Ruch, Plasma Process. Polym. 2008, 5, 788.
29. B. Twomey, D. Dowling, G. Byrne, L. O'Neill, L.-A. O'Hare, Plasma Process. Polym. 2007, 4, S450.
30. J. Schäfer, R. Foest, A. Quade, A. Ohl, K. D. Weltmann, Plasma Process. Polym. 2009, 6, S519.
31. A. Ramamoorthy, M. Rahman, D. A. Mooney, J. M. Don, D. P. MacElroy Dowling, Plasma Process. Polym. 2009, 6, S530.
32. X. Xu, L. Li, S. Wang, L. Zhao, T. Ye, Plasma Sources Sci. Technol. 2007, 16, 372.
33. S. E. Babayan, J. Y. Jeong, A. Schütze, V. J. Tu, M. Moravej, G. S. Selwyn, R. F. Hicks, Plasma Sources Sci. Technol. 2001, 10, 573.
34. P. A. Premkumar, S. A. Starostin, H. de Vries, R. M. J. Paffen, M. Creatore, T. J. Eijkemans, P. M. Koenraad, M. C. M. van de Sanden, Plasma Process. Polym. 2009, 6, 693.
35. F. Massines, N. Gherardi, A. Fornelli, S. Martin, Surf. Coat. Technol. 2005, 200, 1855.
36. I. Vinogradov, D. Zimmer, A. Lunk, Plasma Process. Polym. 2007, 4, S435.
37. Cold plasma deposition of organosilicon films with different monomers in a DBD discharge, S. Lovascio, Ph.D. Thesis, Università degli Studi di Bari, Université Pierre et Marie Curie 2010.
38. Plasma Polymerization, H. Yasuda, Ed., Academic Press, London 1985.
39. D. Hegemann, E. Körner, S. Guimond, Plasma Process. Polym. 2010, 7, 371.
40. D. Hegemann, E. Körner, S. Guimond, Plasma Process. Polym. 2009, 6, 246.
41. R. D. Short, D. A. Steele, Plasma Process. Polym. 2010, 7, 366.
42. A. von Keudell, J. Benedikt, Plasma Process. Polym. 2010, 7, 376.