Influence of intermetallic characteristics on the solder joint strength of halogen-free printed circuit board assembly

Journal of Electronic Packaging

Volumn 133, Issue 2, 2011, Pages

  Chang, Hung Jen ^a   Chou, Jung Hua ^a   Chang, Tao Chih ^b   Zhan, Chau Jie ^b   Hon, Min Hsiung ^a   Hsi, Chi Shiung ^c  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^c NATIONAL UNITED UNIVERSITY   (Taiwan)

Author keywords

halogen free; intermetallic characteristics; joint strength; lead free solder alloy

Indexed keywords

BALL GRID ARRAYS; COLD ROLLING; COPPER; COPPER ALLOYS; ELECTRONICS PACKAGING; LEAD ALLOYS; LEAD-FREE SOLDERS; METAL CLADDING; NICKEL; PRINTED CIRCUIT BOARDS; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING; TERNARY ALLOYS; TIMING CIRCUITS; TIN ALLOYS;

HALOGEN-FREE; INTERMETALLIC CHARACTERISTIC; INTERMETALLIC COMPOUND LAYER; INTERMETALLICS COMPOUNDS; JOINT STRENGTH; LEAD-FREE SOLDER ALLOY; PB FREE SOLDERS; PULL STRENGTH; SOLDER JOINTS; SOLDERPASTE;

INTERMETALLICS;

EID: 79959706674     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.4003989     Document Type: Article

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