Submodeling analysis for path-dependent thermomechanical problems

Journal of Electronic Packaging

Volumn 127, Issue 2, 2005, Pages 135-140

  Wang, Tong Hong ^a   Lai, Yi Shao ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COMPUTER SIMULATION; COST EFFECTIVENESS; FINITE ELEMENT METHOD; NUMERICAL ANALYSIS; PROBLEM SOLVING; SOLDERING ALLOYS; SOLUTIONS; THERMAL EFFECTS; THERMOMECHANICAL TREATMENT;

NONLINEAR RESPONSE; SOFTWARE PACKAGES; SUBMODELING ANALYSIS; THERMOMECHANICAL PROBLEMS;

ELECTRONICS PACKAGING;

EID: 22944455854     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1869513     Document Type: Article

References (18)

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