Effects of supporting electrolytes on copper electroplating for filling through-hole

Electrochimica Acta

Volumn 56, Issue 17, 2011, Pages 5954-5960

  Chen, Chien Hung ^a   Lu, Chun Wei ^a   Huang, Su Mei ^b   Dow, Wei Ping ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

^b Army Academy   (Taiwan)

Author keywords

Copper electroplating; Supporting electrolyte; Through hole filling

Indexed keywords

BIS(3-SULFOPROPYL)DISULFIDE; COPPER ELECTROPLATING; LINEAR SWEEP VOLTAMMETRY; ORGANIC ADDITIVES; PLATING SOLUTIONS; POTASSIUM IONS; SUPPORTING ELECTROLYTE; THROUGH HOLE; THROUGH-HOLE FILLING;

CHLORINE COMPOUNDS; COPPER PLATING; ELECTROLYTES; ELECTROPLATING; ETHYLENE; FILLING; GLYCOLS; POLYETHYLENE GLYCOLS; PRINTED CIRCUIT BOARDS;

COPPER;

EID: 79958859716     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2011.04.109     Document Type: Article

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