SCOPUS 정보 검색 플랫폼

Electrochemical and Solid-State Letters

Volumn 14, Issue 1, 2011, Pages

Through-hole filling by copper electroplating using a single organic additive

(6) Dow, Wei Ping a Liu, De Huei a Lu, Chun Wei a Chen, Chien Hung a Yan, Jhih Jyun a Huang, Su Mei b

a NATIONAL CHUNG HSING UNIVERSITY (Taiwan)

b Army Academy (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BLIND MICROVIAS; BOTTOM-UP FILLING; CHLORIDE IONS; COPPER DEPOSITION; COPPER ELECTROPLATING; CROSS SECTION; ELECTROCHEMICAL ANALYSIS; ELECTROCHEMICAL BEHAVIORS; ORGANIC ADDITIVES; PLATING SOLUTIONS; THROUGH HOLE;

CHLORINE COMPOUNDS; COPPER; ELECTROPLATING; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE;

FILLING;

EID: 78751527605 PISSN: 10990062 EISSN: None Source Type: Journal
DOI: 10.1149/1.3511757 Document Type: Article

Times cited : (51)

References (11)

1
- 1642390368
- 10.1108/03056120410520597
- W.-P. Dow and H.-H. Chen, Circuit World, 30, 33 (2004). 10.1108/03056120410520597
- (2004) Circuit World , vol.30 , pp. 33
- Dow, W.-P.¹ Chen, H.-H.²

2
- 54949135453
- 10.1149/1.2988134
- W.-P. Dow, H.-H. Chen, M.-Y. Yen, W.-H. Chen, K.-H. Hsu, P.-Y. Chuang, H. Ishizuka, N. Sakagawa, and R. Kimizukad, J. Electrochem. Soc., 155, D750 (2008). 10.1149/1.2988134
- (2008) J. Electrochem. Soc. , vol.155 , pp. 750
- Dow, W.-P.¹ Chen, H.-H.² Yen, M.-Y.³ Chen, W.-H.⁴ Hsu, K.-H.⁵ Chuang, P.-Y.⁶ Ishizuka, H.⁷ Sakagawa, N.⁸ Kimizukad, R.⁹

3
- 33646411500
- 10.1149/1.2189238
- P. Dixit and J. Miao, J. Electrochem. Soc., 153, G552 (2006). 10.1149/1.2189238
- (2006) J. Electrochem. Soc. , vol.153 , pp. 552
- Dixit, P.¹ Miao, J.²

4
- 33747670896
- Fabrication of high aspect ratio 35 μm pitch through-wafer copper interconnects by electroplating for 3-D wafer stacking
- DOI 10.1149/1.2236374
- P. Dixit, J. Miao, and R. Preisser, Electrochem. Solid-State Lett., 9, G305 (2006). 10.1149/1.2236374 (Pubitemid 44270901)
- (2006) Electrochemical and Solid-State Letters , vol.9 , Issue.10
- Dixit, P.¹ Miao, J.² Preisser, R.³

5
- 33846410639
- Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins
- DOI 10.1063/1.2432284
- L. Xu, P. Dixit, J. Miao, J. H. L. Pang, X. Zhang, K. N. Tu, and R. Preisser, Appl. Phys. Lett., 90, 033111 (2007). 10.1063/1.2432284 (Pubitemid 46146389)
- (2007) Applied Physics Letters , vol.90 , Issue.3 , pp. 033111
- Xu, L.¹ Dixit, P.² Miao, J.³ Pang, J.H.L.⁴ Zhang, X.⁵ Tu, K.N.⁶ Preisser, R.⁷

6
- 14744275071
- Roles of chloride ion in microvia filling by copper electrodeposition I. Studies using SEM and optical microscope
- DOI 10.1149/1.1849934
- W.-P. Dow and H.-S. Huang, J. Electrochem. Soc., 152, C67 (2005). 10.1149/1.1849934 (Pubitemid 40325832)
- (2005) Journal of the Electrochemical Society , vol.152 , Issue.2
- Dow, W.-P.¹ Huang, H.-S.²

7
- 61349100773
- 10.1149/1.3078407
- W.-P. Dow, Y.-D. Chiu, and M.-Y. Yen, J. Electrochem. Soc., 156, D155 (2009). 10.1149/1.3078407
- (2009) J. Electrochem. Soc. , vol.156 , pp. 155
- Dow, W.-P.¹ Chiu, Y.-D.² Yen, M.-Y.³

8
- 13844256568
- 10.1147/rd.491.0003
- P. M. Vereecken, R. A. Binstead, H. Deligianni, and P. C. Andricacos, IBM J. Res. Dev., 49, 3 (2005). 10.1147/rd.491.0003
- (2005) IBM J. Res. Dev. , vol.49 , pp. 3
- Vereecken, P.M.¹ Binstead, R.A.² Deligianni, H.³ Andricacos, P.C.⁴

9
- 0345406940
- 10.1021/j100445a006
- B. H. J. Bielski, G. G. Shiue, and S. Bajuk, J. Phys. Chem., 84, 830 (1980). 10.1021/j100445a006
- (1980) J. Phys. Chem. , vol.84 , pp. 830
- Bielski, B.H.J.¹ Shiue, G.G.² Bajuk, S.³

10
- 0024957999
- 10.1246/bcsj.62.3783
- K. Umemoto, Bull. Chem. Soc. Jpn., 62, 3783 (1989). 10.1246/bcsj.62.3783
- (1989) Bull. Chem. Soc. Jpn. , vol.62 , pp. 3783
- Umemoto, K.¹

11
- 1642473892
- 10.1016/j.ica.2003.05.007
- T. Oritani, N. Fukuhara, T. Okajima, F. Kitamura, and T. Ohsaka, Inorg. Chim. Acta, 357, 436 (2004). 10.1016/j.ica.2003.05.007
- (2004) Inorg. Chim. Acta , vol.357 , pp. 436
- Oritani, T.¹ Fukuhara, N.² Okajima, T.³ Kitamura, F.⁴ Ohsaka, T.⁵

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