Synthesis and practicability of novel additives for copper electroplating with semiconductor packaging

Journal of Applied Polymer Science

Volumn 96, Issue 3, 2005, Pages 837-840

  Sugimoto, Masaharu ^a   Yamaguchi, Kazuki ^a   Kouzai, Hiroaki ^a   Honma, Hideo ^a  

^a KANTO GAKUIN UNIVERSITY   (Japan)

Author keywords

Oligomers; Polyethers; Water soluble polymers

Indexed keywords

ADSORPTION; ELECTRONICS PACKAGING; ELECTROPLATING; LSI CIRCUITS; OLIGOMERS; POLYETHERS; POLYETHYLENE GLYCOLS;

COPPER ELECTROPLATING; ORGANIC ADDITIVES; VIA-FILLING PROPERTIES; WATER-SOLUBLE POLYMERS;

COPPER;

ELECTROPLATING;

EID: 17444411910     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/app.21490     Document Type: Article

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