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Journal of the Electrochemical Society

Volumn 158, Issue 6, 2011, Pages

Low stress polycrystalline SiC thin films suitable for MEMS applications

(4) Fu, Xiao An a,b Dunning, Jeremy L a Mehregany, Mehran a Zorman, Christian A a

a Case Western Reserve University (United States)

b University of Louisville (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AS-DEPOSITED FILMS; DICHLOROSILANES; INTERFEROMETRIC MEASUREMENT; LOW STRESS; MEMS APPLICATIONS; MICROMACHINED STRUCTURES; POLY-SIC; POLYCRYSTALLINE SIC; RESIDUAL FILM STRESS; RESONANT STRUCTURES; SIC FILMS; STRESS GRADIENT; UPPER BOUND; WAFER CURVATURE MEASUREMENT; WAFER CURVATURE TECHNIQUE; YOUNG'S MODULUS;

ACETYLENE; CHEMICAL VAPOR DEPOSITION; CHLORINE; NANOCANTILEVERS; RESIDUAL STRESSES; SILICON CARBIDE; SILICON WAFERS; STRESS MEASUREMENT; TENSILE STRESS; THICK FILMS; THIN FILMS;

SEMICONDUCTING SILICON COMPOUNDS;

EID: 79955539259 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.3575160 Document Type: Article

Times cited : (22)

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