Influence of thermal treatment on the glass transition temperature of thermosetting epoxy laminate

Polymer Testing

Volumn 28, Issue 4, 2009, Pages 428-436

  Polansky R ^a   Mentlik V ^a   Prosr, P ^a   Susir J ^a  

^a UNIVERSITY OF WEST BOHEMIA   (Czech Republic)

Author keywords

Activation energy; Arrhenius plot; Composite; Dynamic mechanical analysis; Epoxy resin; Printed circuit board

Indexed keywords

COMPOSITE; CRITICAL TEMPERATURES; GLASS FIBRES; GLASS TRANSITION TEMPERATURES; INNER STRUCTURES; MICROSCOPIC ANALYSIS; PRINTED CIRCUIT BOARD MANUFACTURING; RELAXATION MECHANISMS; SAMPLE STRUCTURES; SMALL REGIONS; THERMAL DEGRADATIONS; THERMAL TREATMENTS; THERMOSETTING EPOXIES;

ACTIVATION ANALYSIS; ACTIVATION ENERGY; ARRHENIUS PLOTS; DEGRADATION; DYNAMIC ANALYSIS; DYNAMIC MECHANICAL ANALYSIS; ELECTROMAGNETIC WAVE EMISSION; EPOXY RESINS; GLASS FIBERS; HEAT TREATMENT; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; RANGE FINDING; RELAXATION PROCESSES; RESINS; SUPERCONDUCTING TRANSITION TEMPERATURE; SURFACE RELAXATION; THERMOSETS;

GLASS TRANSITION;

EID: 67349153698     PISSN: 01429418     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymertesting.2009.03.004     Document Type: Article

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