Application of underfill for flip-chip package using ultrasonic bonding

Japanese Journal of Applied Physics

Volumn 47, Issue 5 PART 2, 2008, Pages 4257-4261

  Noh, Bo In ^a   Koo, Ja Myeong ^a   Jo, Jung Lae ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Electrical resistance; Gold bump; Shear strength; Ultrasonic bonding; Underfill

Indexed keywords

CRACKS; FATIGUE OF MATERIALS; FLIP CHIP DEVICES; GLASS; HYDRODYNAMICS; SHEAR STRENGTH; THERMAL EXPANSION; THERMAL SPRAYING; ULTRASONICS; VISCOSITY;

AU BUMPS; CHIP PACKAGES; COEFFICIENT OF THERMAL EXPANSIONS; DWELL TIMES; ELECTRICAL RESISTANCE; ELECTRICAL RESISTANCES; FATIGUE CRACKS; FATIGUE LIVES; GLASS SUBSTRATES; GLASS TRANSITION TEMPERATURES; GOLD BUMP; ULTRASONIC BONDING; ULTRASONIC BONDINGS; UNDERFILL; UNDERFILLS; VOID FORMATIONS;

GLASS TRANSITION;

EID: 54949109816     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.47.4257     Document Type: Article

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