An experimental methodology for the study of co-planarity variation effects in anisotropic conductive adhesive assemblies

Soldering and Surface Mount Technology

Volumn 22, Issue 1, 2010, Pages 47-55

  Dou, Guangbin ^a   Whalley, David C ^b   Liu, Changqing ^b   Chan, Y C ^c  

^a IMPERIAL COLLEGE LONDON   (United Kingdom)

^b LOUGHBOROUGH UNIVERSITY   (United Kingdom)

^c CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Adhesives; Assembly; Bonding; Flipchips; Joining processes

Indexed keywords

ANISOTROPIC CONDUCTIVE ADHESIVES; BOND THICKNESS; BONDING FORCES; BONDING PRESSURE; BONDING PROCESS; COPLANARITY; DEFORMATION DEGREES; DESIGN/METHODOLOGY/APPROACH; DIFFERENT GEOMETRY; ELECTRICAL JOINTS; ELECTRICAL PERFORMANCE; EXPERIMENTAL METHODOLOGY; FLIP CHIP; FOUR-WIRE; JOINING PROCESS; JOINING PROCESSES; JOINT RESISTANCE; NEW EXPERIMENTAL METHOD; PLANARITY; PRIMARY OBJECTIVE; SCANNING ELECTRON MICROSCOPES; SEM; SUBSTRATE PATTERN; TEST ASSEMBLY;

ADHESIVES; ANISOTROPY; CONDUCTIVE MATERIALS; DEFORMATION; ELECTRIC RESISTANCE MEASUREMENT; ELECTRONICS PACKAGING; EXPERIMENTS; JOINING; ROTATION; SCANNING ELECTRON MICROSCOPY; SUBSTRATES;

ADHESIVE JOINTS;

EID: 76049091229     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540911011015148     Document Type: Article

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