ACF curing process optimization based on degree of cure considering contact resistance degradation of joints

Soldering & Surface Mount Technology

Volumn 22, Issue 4, 2010, Pages 4-12

  Tao, B ^a   Yin, Zhouping ^a   Xiong, Youlun ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Films (states of matter); Flipchips; Joining processes; Packaging

Indexed keywords

ADHESION STRENGTHS; ADHESIVE STRENGTH; ANISOTROPICALLY CONDUCTIVE ADHESIVE; CONFIDENCE INTERVAL; CURING PROCESS; DEGRADATION DATA; DEGREE OF CURE; DESIGN/METHODOLOGY/APPROACH; DISTRIBUTION PARAMETERS; ELECTRICAL AND MECHANICAL PROPERTIES; FAILURE TIME; FATIGUE TESTS; FILMS (STATES OF MATTER); FLIP CHIP; FLIP-CHIP BONDING; FLIP-CHIP JOINTS; FLIP-CHIP PACKAGING; GLASS PACKAGING; JOINING PROCESSES; PACKAGING APPLICATIONS; PERFORMANCE VARIATIONS; RELIABILITY ANALYSIS METHOD; RELIABILITY INDEX; RESISTANCE DEGRADATION; RESISTANCE DISTRIBUTION; TWO-PARAMETER WEIBULL MODEL;

CHIP SCALE PACKAGES; CONTACT RESISTANCE; CURING; DEGRADATION; DIAMOND CUTTING TOOLS; ELECTRIC PROPERTIES; FATIGUE TESTING; FLIP CHIP DEVICES; GLASS BONDING; GLASS PLANTS; JOINING; LIQUID CRYSTAL DISPLAYS; LIQUID CRYSTALS; MECHANICAL PROPERTIES; NUMERICAL ANALYSIS; OPTIMIZATION; PACKAGING; RELIABILITY ANALYSIS; WEIBULL DISTRIBUTION;

QUALITY ASSURANCE;

EID: 77957579614     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540911011076835     Document Type: Article

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