Electrical characterization of anisotropic conductive adhesive based flip chip for a direct access sensor

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 369-374

  Jesudoss, Pio ^a   Chen, Wenbin ^b   Mathewson, Alan ^a   Wright, William M D ^b   McCarthy, Kevin G ^b   Stam, Frank ^a  

^a UNIVERSITY COLLEGE CORK   (Ireland)

^b UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPIC CONDUCTIVE ADHESIVES; BEFORE AND AFTER; DIELECTRIC CONSTANTS; DIRECT ACCESS; DIRECT CONTACT; ELECTRICAL CHARACTERIZATION; FINE PITCH; FLIP CHIP; FLIP CHIP ASSEMBLIES; FLUID ENVIRONMENT; FREQUENCY SWEEP; HIGH-SPEED INTERCONNECTION; IMAGINARY PARTS; IMPEDANCE ANALYZER; IMPEDANCE PARAMETERS; INTERCONNECT MATERIALS; INTERCONNECT STRUCTURES; LOW COSTS; LOW PROCESSING TEMPERATURE; REAL PART; RESONANT FREQUENCIES; RF-ID TAGS; SEMICONDUCTOR PACKAGES; SOAK TESTING;

ANISOTROPY; CHIP SCALE PACKAGES; CONDUCTIVE MATERIALS; ELECTRONIC EQUIPMENT MANUFACTURE; FLAT PANEL DISPLAYS; FREQUENCY RESPONSE; MOBILE PHONES; MOISTURE; NATURAL FREQUENCIES; PROCESSING; RADIO NAVIGATION; SENSORS; TELECOMMUNICATION EQUIPMENT;

ADHESIVE JOINTS;

EID: 77955182617     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490945     Document Type: Conference Paper

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