Moisture induced interface weakening in ACF package

Materials Science and Engineering: A

Volumn 528, Issue 2, 2010, Pages 698-705

  Sim, Gi Dong ^a   Chung, Chang Kyu ^a   Paik, Kyung Wook ^a   Lee, Soon Bok ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Adhesion; Anisotropic conductive film (ACF); Delamination; Environmental degradation; Moisture absorption

Indexed keywords

ACOUSTIC MICROSCOPES; ADHESION; ADHESIVES; ANISOTROPY; CRACKS; DEGRADATION; FAILURE (MECHANICAL); FLIP CHIP DEVICES; FRACTURE TOUGHNESS; GEOMETRICAL OPTICS; MOISTURE; SCANNING ELECTRON MICROSCOPY;

%MOISTURE; 4-POINT BENDING TESTS; ANISOTROPIC CONDUCTIVE FILM; ANISOTROPIC CONDUCTIVE FILMS; DEGRADATION MECHANISM; EXPOSED TO; FLIP-CHIP INTERCONNECTION; HUMIDITY CONDITIONS; INTERFACIAL FRACTURE TOUGHNESS; MOISTURE ABSORPTION;

DELAMINATION;

EID: 78049528819     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2010.09.051     Document Type: Article

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