Effects of temperature and strain rate on the mechanical properties of lead-free solders

Journal of Materials Science

Volumn 45, Issue 9, 2010, Pages 2351-2358

  Ma, Hongtao ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EFFECTS OF TEMPERATURE AND STRAIN RATE; EXPERIMENTAL DATA; LEAD CONTENT; LEAD FREE SOLDERS; LEAD-FREE; LINEAR RELATIONSHIPS; POWER LAW RELATIONSHIP; ROOM TEMPERATURE; SNPB SOLDER; TEMPERATURE RANGE; ULTIMATE STRENGTH; ULTIMATE STRESS;

CONSTITUTIVE MODELS; LEAD; MECHANICAL PROPERTIES; STIFFNESS; STRESSES; TEMPERATURE; TENSILE TESTING; TIN; YIELD STRESS;

STRAIN RATE;

EID: 77951665284     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-009-4200-6     Document Type: Article

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