Design-for-reliability implementation in microelectronics packaging development

Microelectronics International

Volumn 28, Issue 1, 2011, Pages 29-40

  Yang, Liyu ^a   Niu, Rui ^b   Xie, Jinsong ^c   Qian, Bin ^a   Song, Baishi ^b   Rong, Qingan ^b   Bernstein, Joseph ^d,e  

^a NVIDIA   (United States)

^b HUAWEI TECHNOLOGIES CO LTD   (China)

^c BEIHANG UNIVERSITY   (China)

^d UNIVERSITY OF MARYLAND   (United States)

^e BAR ILAN UNIVERSITY   (Israel)

Author keywords

Design management; Electronic engineering; Manufacturing systems; Packaging; Reliability management; Supply chain management

Indexed keywords

ARRAY PACKAGES; DESIGN MANAGEMENT; DESIGN/METHODOLOGY/APPROACH; ELECTRONIC ENGINEERING; ELECTRONIC PACKAGE; ELECTRONICS MANUFACTURING SERVICES; END-PRODUCTS; FABLESS DESIGN HOUSE; FLIP-CHIP BALL; MANUFACTURING SYSTEM; MICROELECTRONICS PACKAGING; ORIGINAL EQUIPMENT MANUFACTURERS; PACKAGE DEVELOPMENT; PACKAGE RELIABILITY; RELIABILITY IMPACTS; RELIABILITY MANAGEMENT; RESEARCH RESULTS; SILICON TECHNOLOGIES; SYSTEM EVALUATION;

DESIGN; INDUSTRIAL RESEARCH; MANAGEMENT; MICROELECTRONICS; PACKAGING; QUALITY ASSURANCE; QUALITY CONTROL; RELIABILITY; SUPPLY CHAINS;

SUPPLY CHAIN MANAGEMENT;

EID: 79551473222     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565361111097092     Document Type: Article

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