The effect of stencil printing optimization on reliability of cbga and pbga solder joints

Journal of Electronic Packaging, Transactions of the ASME

Volumn 120, Issue 1, 1998, Pages 54-60

  Li, Y ^a   Mahajan, R L ^a   Subbarayan, G ^a  

^a UCB 450   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; OPTIMIZATION; PLASTICS; SOLDERED JOINTS; STRAIN; THERMAL CYCLING;

CERAMIC BALL GRID ARRAYS (CBGA); MODIFIED COFFIN MANSON RELATIONSHIP; PLASTIC BALL GRID ARRAYS (PBGA); STENCIL PRINTING;

ELECTRONICS PACKAGING;

EID: 0032025972     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792286     Document Type: Article

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