Fatigue life of solder bumps in a system in package: Relating power cycling to thermal cycling

7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006

Volumn 2006, Issue , 2006, Pages

  Beijer, J G J ^a   Jansen, M Y ^a   Janssen, G M ^a   Bielen, J A ^b   Tijssen, E P A ^b  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

^b NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; THERMAL CYCLING; THERMAL STRESS;

FATIGUE FRACTURES; HEAT PENETRATION DEPTH; TEMPERATURE CYCLE TESTS (TCT); THERMAL TRANSIENT;

SOLDERED JOINTS;

EID: 33847125781     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2006.1643987     Document Type: Conference Paper

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