Environmental-stress screening improves electronic-design reliability

EDN

Volumn 46, Issue 21, 2001, Pages 73-84

  Lakshminarayanan, V ^a,b,c,d  

^a CENTRE FOR DEVELOPMENT OF TELEMATICS   (India)

^b CENTRE FOR DEVELOPMENT OF TELEMATICS   (India)

^c INDIAN INSTITUTE OF SCIENCE   (India)

^d IEEE   (India)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0035921865     PISSN: 00127515     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (7)

1. Kales, P, Reliability Technology for Engineering and Management, Prentice Hall, 1998.
2. Jensen, F, Electronic Component Reliability, John Wiley & Sons, 1995.
3. Reliability Update, American Microsystems Inc, 1998.
4. Peck, D S, et al, Accelerated Testing Handbook, Technology Associates, 1981.
5. Test Methods for Electronic and Electrical Component Parts, MIL-HDBK-202F.
6. Test Method Standard for Microcircuits, MIL-HDBK-883E.
7. Environmental Test Methods and Engineering Guidelines, MIL-HDBK-810.