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Volumn , Issue , 2006, Pages 101-104
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Underfill assessments and validations for low-k FCBGA
a
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Author keywords
[No Author keywords available]
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Indexed keywords
CONSUMER PRODUCTS;
ELECTRIC CURRENTS;
ELECTRONIC EQUIPMENT MANUFACTURE;
FAILURE ANALYSIS;
FAILURE MODES;
FINITE ELEMENT METHOD;
MATERIALS SCIENCE;
MECHANICAL PROPERTIES;
MICROSYSTEMS;
PHOTOMASKS;
QUALITY ASSURANCE;
RELIABILITY;
TESTING;
THERMAL EXPANSION;
THERMAL SPRAYING;
VEHICLE TRANSMISSIONS;
COEFFICIENT OF THERMAL EXPANSION (CLTE);
DIELECTRIC LAYERS;
ELECTRICAL CHARACTERISTICS;
ELECTRICAL PERFORMANCES;
FINITE ELEMENT (FE) MODELING;
FLIP CHIPPING;
FORM FACTORS;
HEAT SPREADERS;
HIGH PERFORMANCE;
HIGH SPEEDS;
HIGH TRANSMISSION;
I/O PINS;
IC CHIPS;
IN ORDER;
INTERNATIONAL (CO);
LOW DIELECTRIC CONSTANT (LKD);
LOW-K MATERIALS;
MATERIAL SELECTIONS;
MODELING RESULTS;
MODELING TECHNIQUES;
PROPERTY (S);
RELIABILITY TESTING;
SIGNAL DELAYS;
SILICON CHIPS;
TECHNICAL PAPERS;
TEMPERATURE LOADINGS;
TEST VEHICLES;
UNDERFILL;
UNDERFILL MATERIALS;
CHIP SCALE PACKAGES;
COMPUTER CHIPS;
CRACKS;
DELAMINATION;
DIELECTRIC CONSTANT;
DIES;
ELECTRIC CIRCUITS;
ELECTRIC CURRENT;
ELECTRONIC EQUIPMENT;
MECHANICAL PROPERTIES;
PACKAGING;
QUALITY CONTROL;
RELIABILITY;
THERMAL EXPANSION;
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EID: 46249090057
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/IMPACT.2006.312200 Document Type: Conference Paper |
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Times cited : (15)
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References (1)
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