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Journal of Electronic Materials

Volumn 39, Issue 1, 2010, Pages 109-114

Size and substrate effects upon undercooling of Pb-free solders

(3) Huang, Yu Chih a Chen, Sinn Wen a Wu, Kuang Siang a

a NATIONAL TSING HUA UNIVERSITY (Taiwan)

Author keywords

Pb free solders; Primary solidification phase; Size effect; Undercooling

Indexed keywords

ALLOYING ADDITIONS; COMPOSITIONAL EFFECTS; PB-FREE SOLDERS; PHASE SIZE; PRIMARY FACTORS; RELATIVE ORDER; SIZE EFFECT; SUBSTRATE EFFECTS;

ALLOYING ELEMENTS; CRYSTALLIZATION; DIFFERENTIAL SCANNING CALORIMETRY; LEAD; SILVER; SUBSTRATES; TIN;

UNDERCOOLING;

EID: 74449085178 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0966-1 Document Type: Article

Times cited : (48)

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