New efficient method of modeling electronics packages with layered power/ground planes

IEEE Transactions on Advanced Packaging

Volumn 25, Issue 3, 2002, Pages 417-423

  Shi, Weimin ^a   Fang, Jiayuan ^b  

^a INTEL CORPORATION   (United States)

^b University of California Santa Cruz   (United States)

Author keywords

Boundary integral method; Electronics packages; Power and ground planes

Indexed keywords

COMPUTER SIMULATION; DIELECTRIC LOSSES; ELECTROMAGNETIC FIELDS; INTEGRAL EQUATIONS; PRINTED CIRCUIT BOARDS; SKIN EFFECT;

METAL PLANES;

ELECTRONICS PACKAGING;

EID: 0036706369     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2002.805992     Document Type: Conference Paper

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